Power Distribution Electronic Architect (m/f/d) (Zonal Controllers), Bietigheim-Bissingen

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Power Distribution Electronic Architect (m/f/d) (Zonal Controllers), Bietigheim-Bissingen

Unbefristeter Arbeitsvertrag
Feinmechanik
Ingenieur
Veröffentlicht seit ein Tag
 

Valeo

The mission of the thermal systems business group is to develop and manufacture systems, modules and components to ensure thermal energy management of the power train and comfort for each passenger, during all phases of vehicle use. These systems help to significantly reduce fuel consumption, CO2 emissions and other pollutants and harmful particles from vehicles equipped with internal combustion engines. They also increase travel range and battery life for hybrid and electric vehicles. At the Front Office in Bietigheim-Bissingen we are supporting Sale- and Project activities and compose the interface between the customers Daimler and Valeo-internal departments at the development from Thermal Systems.

Tasks

  • Architectural Leadership: Define the end-to-end Power Distribution HW architecture for Zonal Controllers, focusing on E-fuses, smart switching, and power sequencing.
  • Platform Development: Lead the HW engineering team through the platform lifecycle, ensuring design reuse and modularity across different OEM requirements.
  • RFQ Strategy: Act as the technical lead for Request for Quotations (RFQs), transforming customer requirements into competitive, high-performance hardware concepts and BOM estimations.
  • Functional Safety: Collaborate with Systems Engineers to implement ISO 26262 requirements (up to ASIL-D) within the power stages.
  • Technical Roadmap: Evaluate emerging technologies (e.g., GaN/SiC, advanced MOSFET packaging) to keep our platform at the cutting edge of the Tier 1 market.

Profile

  • B.S./M.S. in Electrical Engineering or a related field.
  • Several years of experience in Automotive HW development, with at least 3 years in an Architect or Lead role.
  • Direct experience with Zonal or Body Control Module (BCM) architectures is highly preferred.
  • Deep knowledge of high-current PCB design, thermal management, and semiconductor selection (MOSFETs, Gate Drivers, Shunts).
  • Intelligent Power Distribution: Proven experience with E-fuses, wire-harness protection strategies, and "sleep-to-wake" power management.
  • System Analysis: Ability to perform Worst-Case Analysis (WCA), Thermal Simulations, and FMEA at an architectural level.
  • Strategic Thinking, good Communication Skills
  • Experience leading cross-functional HW teams in a fast-paced, global environment.

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